SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

______________________

 

FORM 6-K

 

REPORT OF A FOREIGN ISSUER

PURSUANT TO RULE 13A-16 OR 15D-16

OF THE SECURITIES EXCHANGE ACT OF 1934

For June 2006

 

______________________

 

ASML Holding N.V.

 

De Run 6501

5504 DR Veldhoven

The Netherlands

( Address of principal executive offices )

______________________

 

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

 

Form 20-F x

 

Form 40-F o

 

Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.

 

Yes o

 

No x

 

If ''Yes'' is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b):

 

 

 

 


 

 

 

 

 


Exhibits

 

99.1

"ASML Announces Update of its Share Buyback Program," press release dated June 13, 2006

 

99.2

"ASML Announces Update of its Share Buyback Program," press release dated June 20, 2006

 

99.3

"ASML Announces Update of its Share Buyback Program," press release dated June 27, 2006

 

99.4

"Privileged Environment for Leadership - ISS Europe 2006," presentation dated February 13, 2006

 

99.5

"ASML Operates in a Growing Lithography Market" Cheuvreux Technology & IT Conference presentation dated March 17, 2006

 

99.6

"Credit Suisse Semiconductor and Semiconductor Capital Equipment Conference," presentation dated May 3, 2006

 

99.7

"JP Morgan 34 th Annual Technology Conference," presentation dated May 23, 2006

 

99.8

"Merrill Lynch TMT Conference – London," presentation dated June 6, 2006

 

99.9

"Bear Stearns 17 th Annual Technology Conference – New York," presentation dated June 13, 2006

 

 

"Safe Harbor" Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements that are subject to risks and uncertainties including, but not limited to, economic conditions, product demand and industry capacity, competitive products and pricing, manufacturing efficiencies, new product development, ability to enforce patents, the outcome of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, and other risks indicated in filings with the U.S. Securities and Exchange Commission.

 

 


 

 

SIGNATURES

 

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

 

 

ASML HOLDING N.V. (Registrant)

 

 

 

Date: July 13, 2006

By:

/s/ Peter T.F.M. Wennink

 

 

Peter T.F.M. Wennink

 

 

Executive Vice President

 

 

and Chief Financial Officer

 

 

 

2

 

 

 

Exhibit 99.1

 

ASML Announces Update of its Share Buyback Program

 

VELDHOVEN, the Netherlands, June 13, 2006 – ASML Holding NV (ASML) today announced progress in connection with its share buyback program disclosed on April 19, 2006 as follows:

 

 

•

To effect share repurchases under its buyback program, ASML enters into forward purchase transactions with a broker acting as principal. Under the terms of these transactions, the exact number of shares that are to be purchased by the broker and delivered to ASML, as well as timing of purchases, is left to the discretion of the broker, within pre-agreed ranges.

 

 

•

During the period from June 7 to June 9, 2006, ASML acquired 2,900,000 of its shares from the broker pursuant to the share buyback program, at an average price of EUR 15.77 per share.

 

 

•

The aggregate amount of shares bought back up to and including June 9, 2006 is 9,312,920 and represents 36.4 percent of the announced objective of maximum EUR 400 million to be repurchased during the term of the program.

 

 

•

ASML’s share buyback program was announced on April 19, 2006 and will terminate on April 18, 2007.

 

 

•

ASML intends to cancel its repurchased shares.

 

About ASML

 

ASML is the world's leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML.

 

ASML

 

Tom McGuire

Vice President Communications

corpcom@asml.com

tel: +31.40.268.5758

fax: +31.40.268.3655

 

Angelique Paulussen

Senior Director Corporate Communications

corpcom@asml.com  

tel: +31.40.268.6572

fax: +31.40.268.3655

 

Craig DeYoung

Vice President Investor Relations

craig.deyoung@asml.com

tel: +1.480.383.4005

fax: +1.480.383.3976

 

Franki D'Hoore

Director European Investor Relations

franki.dhoore@asml.com

tel: +31.40.268.6494

fax: +31.40.268.3655

 

 

 

 

Exhibit 99.2

 

ASML Announces Update of its Share Buyback Program

 

VELDHOVEN, the Netherlands, June 20, 2006 – ASML Holding NV (ASML) today announced progress in connection with its share buyback program disclosed on April 19, 2006 as follows:

 

 

•

To effect share repurchases under its buyback program, ASML enters into forward purchase transactions with a broker acting as principal. Under the terms of these transactions, the exact number of shares that are to be purchased by the broker and delivered to ASML, as well as timing of purchases, is left to the discretion of the broker, within pre-agreed ranges.

 

 

•

During the period from June 12 to June 16, 2006, ASML acquired 3,467,078 of its shares from the broker pursuant to the share buyback program, at an average price of EUR 15.71 per share.

 

 

•

The aggregate amount of shares bought back up to and including June 16, 2006 is 12,779,998 and represents 50.0 percent of the announced objective of maximum EUR 400 million to be repurchased during the term of the program.

 

 

•

ASML’s share buyback program was announced on April 19, 2006 and will terminate on April 18, 2007.

 

 

•

ASML intends to cancel its repurchased shares.

 

About ASML

 

ASML is the world's leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML.

 

ASML

 

Tom McGuire

Vice President Communications

corpcom@asml.com

tel: +31.40.268.5758

fax: +31.40.268.3655

 

Angelique Paulussen

Senior Director Corporate Communications

corpcom@asml.com  

tel: +31.40.268.6572

fax: +31.40.268.3655

 

Craig DeYoung

Vice President Investor Relations

craig.deyoung@asml.com

tel: +1.480.383.4005

fax: +1.480.383.3976

 

Franki D'Hoore

Director European Investor Relations

franki.dhoore@asml.com

tel: +31.40.268.6494

fax: +31.40.268.3655

 

 

 

 

Exhibit 99.3

 

ASML Announces Update of its Share Buyback Program

 

VELDHOVEN, the Netherlands, June 27, 2006 – ASML Holding NV (ASML) today announced progress in connection with its share buyback program disclosed on April 19, 2006 as follows:

 

 

•

To effect share repurchases under its buyback program, ASML enters into forward purchase transactions with a broker acting as principal. Under the terms of these transactions, the exact number of shares that are to be purchased by the broker and delivered to ASML, as well as timing of purchases, is left to the discretion of the broker, within pre-agreed ranges.

 

 

•

During the period from June 20 to June 23, 2006, ASML acquired 3,400,000 of its shares from the broker pursuant to the share buyback program, at an average price of EUR 15.95 per share.

 

 

•

The aggregate amount of shares bought back up to and including June 23, 2006 is 16,179,998 and represents 63.6 percent of the announced objective of maximum EUR 400 million to be repurchased during the term of the program.

 

 

•

ASML’s share buyback program was announced on April 19, 2006 and will terminate on April 18, 2007.

 

 

•

ASML intends to cancel its repurchased shares.

 

About ASML

 

ASML is the world's leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML.

 

ASML

 

Tom McGuire

Vice President Communications

corpcom@asml.com

tel: +31.40.268.5758

fax: +31.40.268.3655

 

Angelique Paulussen

Senior Director Corporate Communications

corpcom@asml.com  

tel: +31.40.268.6572

fax: +31.40.268.3655

 

Craig DeYoung

Vice President Investor Relations

craig.deyoung@asml.com

tel: +1.480.383.4005

fax: +1.480.383.3976

 

Franki D'Hoore

Director European Investor Relations

franki.dhoore@asml.com

tel: +31.40.268.6494

fax: +31.40.268.3655

 

 

 

 

Privileged Environment for Leadership

ISS Europe 2006

Eric Meurice, President and CEO, ASML

Exhibit 99.4

 

Outline

Roadmap for Leadership in Technology
AND Affordability

Successful delivery of the Roadmap

/ Slide 2

 

Customers’ appetite for shrink continues unabated
ahead of Moore’s law

10

12

200

100

80

60

40

Logic

DRAM

NAND

11

07

09

08

04

06

05

01

03

02

00

ASML Product
Introduction

XT:1400

XT:1700i

AT:1200

AT:850

ASML committed to cost effective litho solutions to meet needs

/ Slide 3

 

0.85

0.93

1.20

1.35

1.50

NA

0.25

0.22

0.31

0.28

0.40

0.31

193

   (nm)

Year

22

2011

32

2009

45

2007

65

2005

90

2003

110

2001

Half pitch (nm)

0.25

0.41

0.59

13.5

likely

opportunity

0.40

Infrastructure challenge

Pitch relaxation or

double patterning

0.22

Fluid/

material
challenge

Likely technology roadmap to meet customer
roadmap

Low k 1
challenge

k 1 = (half pitch) * NA / wavelength

Most aggressive k1 in production today is 0.28/0.3
Physical limit single exposure  is 0.25

/ Slide 4

 

Double patterning as a bridge solution to EUV?

Si

Nitride HM

Resist

Int.

Exposure 1

& development

Transfer to

hard mask

Int.

Exposure 2

& development

Transfer to

hard mask

80-nm pitch
k 1 =0.2, ArF, 0.93 NA

Space 1 = Space 2
- Overlay

/ Slide 5

 

ArF Immersion extension with High Index?

>>2010

>2010

2009

2007

Estimated Timing

18%

13%

4%

 

Shrink

33

35

39

40

Minimum Resolution,
k 1 =0.28

1.65

1.55

1.4

1.35

Max NA (0.95 * RI min )

1.9

1.9

1.57

1.57

Refractive Index

New
Material

New
Material

Current

Current

Glass

>1.8

1.65

1.65

1.44

Refractive Index

New

Available

Available

Water

Fluid

/ Slide 6

 

2004

2005

2006

2007

2008

2009

120-90 nm

180-130 nm

280 nm

80-70 nm

65 nm

70 nm

   45 nm

    65 nm

   40 nm

4X0

7X0

8X0

450

760

860

1250 NA=0.85

1250i NA=0.85

1400i NA=0.93

1700i NA=1.2

NA >1.3X

45 nm

32 nm

ADT

32 nm

NA >1.5
or Dbl Pattern

EUV

870

ASML’s product roadmap to meet customer roadmap challenge

875

1400 NA=0.93

/ Slide 7

 

TWINSCAN XT:1700i: 42-nm images

1.2 NA: highest in the industry

Catadioptric lens design

30% increase in resolution

Volume production at 45 nm

-300 nm

NF

+300 nm

+450 nm

-500 nm

-180 nm

+180 nm

42-nm/84-nm pitch,

NA=1.2, =0.89/0.98 dipole X-35, polarized

Resist: 120-nm FFEM RK2101

BARC: 42-nm 1C5D

Top Coat: 140-nm TILC019

Tool: XT:1700Fi

/ Slide 8

 

Integration 2 EUV tools in progress: shipment H1 2006
40 nm L&S, > 10 W/hr, 0.25 NA, 13 nm, 26 mm field

AD1

AD2

First

200-nm

image

/ Slide 9

 

Litho cost places EUV favorably vs. other technologies

XT:850

XT:1250

XT:1400

XT:1700

EUV

ArFi DP

ArFi hi

EUV

ArFi DP

130

90

65

45

32

32

32

22

22

2001

2003

2005

2007

2009

2009

2011

2011

2011

Mask cost high

Mask cost low

Litho cost

Source: ASML

/ Slide 10

 

Cost per layer =

Cost

Productivity

Improvements in productivity, cost
effective lens, and equipment
design deliver lower cost per layer

ASML solution to increasing technology costs: continuous
productivity improvement of TWINSCAN & advanced lens solutions

0

25

50

75

100

125

150

2001

2002

2003

2004

2005

2006

0

2

4

6

8

10

12

0.75

2001

0.85

2003

0.93

2005

1.2

2006

>1.3

2007

NA :
Year :

Dry

Wet

Catadioptric

Geometric

Dioptric

Lens Design

Source:ASML

/ Slide 11

 

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

2000

2002

2004

2006

2008

2010

2012

Lithography cost Affordability:
Cost per minimum Feature 2 continuous shrink

32 nm

ArFi DP

32 nm

EUV

32 nm

ArFi hi

22 nm

ArFi DP

22 nm

EUV

Hi index ArFi
challenged
in timing &
extensibility

CoO of EUV & DP ArFi
support 2 year roadmap

XT:1700i
45 nm

1.2 NA ArFi

AT:850

130 nm

0.8 NA KrF

XT:1250
90 nm

0.85 NA ArF

Source: ASML

XT:1400
65 nm

0.93 NA ArF

/ Slide 12

 

Outline

Roadmap for Leadership in Technology
AND Affordability

Successful delivery of the Roadmap

/ Slide 13

 

ASML IC Litho R&D costs versus total sales

R&D costs exclude settlement
with Nikon Corp. in 2004 and reflect costs for continuing operations

/ Slide 14

 

ASML leveraged knowledge base

Payroll resources ~34%

Contractor/outsourcing ~17%

(Work that can be done more
efficiently outside)

Technology buy ~12%

(Bringing external expertise in-house)

Supplier R&D ~32%

Customer network/
applications partners ~5%

/ Slide 15

 

EUV partnering: Europe is active

/ Slide 16

 

ASML litho specialist pool: large and highly
specialized

ASML employs 2800 in Europe

R&D:

1048 payroll

640 contracted

153

PhD/Dr.

Plus supplier base and technology network:

another 10,000 jobs

/ Slide 17

 

Minimum feature size                     50 nm

Positional accuracy                +/- 10 nm

Note:                                      1nm = 1/1,000,000 mm

300 mm

300-mm wafer

ASML system deliverables: Enlarge a wafer 1 million
times and print the Netherlands in 30 seconds

300 km

The Netherlands

Source: ASML

300 km

X1 million

Corresponds to                                               5 cm

Positional accuracy              +/- 1.0 cm

/ Slide 18

 

ASML system deliverables

Two TWINSCAN TM scanner
stages operate at a speed of
550 mm/s with an accuracy
of 2 nanometer,

which compares to two 747
jumbo jets flying  at 1000 km/hr
the exact same route to an
accuracy of 0.001 millimeter

The reticle stage accelerates

from 0 to 100 km/hour in 1.6 seconds,

leaving every sports car behind.

Reticle stage

Wafer stages

/ Slide 19

 

Conclusions

A clearer, more secured roadmap ahead of
Moore’s Law

A roadmap continuing to deliver reduced cost by
function – litho is affordable

Success hinging on critical mass investment by
ASML and the industry

/ Slide 20

 

Commitment

ASML Operates in a Growing Lithography Market

Franki D’Hoore

Director Investor Relations

March 2006

Exhibit 99.5

 

Safe Harbor

“Safe Harbor” Statement under the U.S. Private Securities
Litigation Reform Act of 1995: the matters discussed in this
document may include forward-looking statements that are
subject to risks and uncertainties including, but not limited to:
economic conditions, product demand and semiconductor
equipment industry capacity, worldwide demand and
manufacturing capacity utilization for semiconductors (the
principal product of our customer base), competitive products
and pricing, manufacturing efficiencies, new product
development, ability to enforce patents, the outcome of
intellectual property litigation, availability of raw materials and
critical manufacturing equipment, trade environment, and other
risks indicated in the risk factors included in ASML’s Annual
Report on Form 20-F and other filings with the U.S. Securities
and Exchange Commission.

 

ASML 2005 Summary

Overall semiconductor equipment market decreased by
nine percent in 2005

At ASML

Sales increased by three percent year on year

Net profit improved by 32 percent to EUR 311 million

Net cash from operations nearly tripled to EUR 711
million in 2005 versus 2004.

 

Litho Growth Opportunity - 3 Long term growth
contributors

Trend                                                                                                                                                                                    Effect on ASML

Semiconductor consumption

assume unit growth 8-10% per year                                          Capacity buys

Moore’s law continuation

leading to technology upgrades                                                Technology buys

Litho Average Selling Price

resultant from Moore’s law                                                                                          Higher ASP

 

Calculations

Assumptions

Fab based model - for each fab, each year:

Roadmaps (t)

Customer

litho

technology

productivity

Req’d. Production

Product

Volume (t)

Litho

Purchases

(#, $)

Req’d.

Litho tool set

Installed

base (t+1)

Next

year

 

Long term growth in semiconductors
for both advanced digital and analog, discrete

Assume long term
semiconductor unit growth
in 8-10% range (take: 9%)

Source: WSTS

 

Customer roadmaps

Model inputs

Source: ASML

10

100

DRAM

Flash

Logic, Foundry

DRAM (trend)

Flash (trend)

Logic, Foundry (trend)

 

Litho technology application

Technology as indication only, actual technologies used may vary

Source: ASML

EUV

ArF-i

EUV

ArF-i

90

65

45

32

22

Critical litho

KrF

ArF

ArF-i

EUV

EUV

Critical Metallization litho

KrF

KrF

ArF

ArF-i

ArF-i

Mid-critical litho

KrF

KrF

KrF

ArF

ArF-i

Implant litho

i-Line

KrF

KrF

KrF

ArF

90

65

45

32

22

Critical litho

ArF

ArF

ArF-i

EUV

Critical Metallization litho

KrF

ArF

ArF

ArF-i

ArF-i

Mid-critical  litho

KrF

KrF

KrF

ArF

ArF-i

Implant litho

KrF

KrF

KrF

KrF

ArF

Node

Node

 

WW litho sales - technology split

ArF is of growing
importance

Source: Dataquest (’00-’04), ASML fab based model (’05-’10)

 

Growing importance of immersion

Immersion will become
the dominant ArF
technology

Source: ASML Fab based Model

 

Litho ASP continues to rise

Litho ASP continues to
rise at 10-15% per year

Source: Dataquest (’81-’04), ASML fab based model (’05-’10)

 

Affordability

Litho cost per
function is 65% of
previous generation

Source: ASML Fab based Model

 

Growth projection lithography sales

Source: Average of Dataquest, VLSI Research and ASML fab based model

Average WW litho sales

ASML’s potential

Status quo

Natural growth
potential towards
4-5 B € range

ASML’s
opportunity
window

 

Future litho market

Analysis of fab based model confirms a growth potential for

ASML towards 4-5 B€ range, under following assumptions:

8% to 10% IC unit growth

Continuing tool ASP growth, delivering lower cost
per function per historical trend

Flawless execution of ASML business model

 

2006 Outlook

Economy continues to perform stronger than
expected.

IC inventories low

Utilization rates remain high so little excess capacity

6 cycles working

Flash memory

DRAM

Foundry

Microprocessor

IDM’s

R&D

.

 

2006 forecast indicates high single digit growth

Average

2006 Semiconductor revenue forecast

0%

5%

10%

15%

20%

25%

iSupply

InStat

Dataquest

SIA

IDC

IC Insights

WSTS

VLSI Research

ML

Semico

Future Horizons

 

2006 Litho Unit Consumption Calculations Summary
- using ASML’s fab based model

      approx. 500

  Litho Units (incl Used) Required

            10%

  Semiconductor Units growth

             8%

  Semiconductor Revenues growth

Source: ASML

Last data point: December 2005

ASML’s fab based model requires several input assumptions that are open
for challenge and discussion.

 

Commitment

Credit Suisse Semiconductor and
Semiconductor Capital Equipment Conference

Craig DeYoung
VP Investor Relations

May 3, 2006
New York                     

Exhibit 99.6

 

Safe Harbor

“Safe Harbor” Statement under the U.S. Private Securities
Litigation Reform Act of 1995: the matters discussed in this
document may include forward-looking statements that are
subject to risks and uncertainties including, but not limited to:
economic conditions, product demand and semiconductor
equipment industry capacity, worldwide demand and
manufacturing capacity utilization for semiconductors (the
principal product of our customer base), competitive products
and pricing, manufacturing efficiencies, new product
development, ability to enforce patents, the outcome of
intellectual property litigation, availability of raw materials and
critical manufacturing equipment, trade environment, and
other risks indicated in the risk factors included in ASML’s
Annual Report on Form 20-F and other filings with the U.S.
Securities and Exchange Commission.

/ Slide 2

 

Agenda

Recent accomplishments

Recent financial summary

Q2 outlook

Company focus 2006

/ Slide 3

 

Accomplishments

/ Slide 4

 

ASML out performs equipment industry growth
in 2005

Source:  VLSI Research, April 2006

-7.1%

23396.8

25191.0

  Total Market

+2.7%

2786.9

2712.4

  ASML

-6.3%

3480.9

3714.0

  Tokyo Electron Ltd.

-22.9%

4444.7

5768.1

  Applied Materials

2005/2004

2005

2004

  IC Fabrication Equipment

/ Slide 5

 

ASML improves its market share by revenue in 2005

VLSIR

Gartner

SEMI

TIN

Semiconductor new systems

x

x

x

x

Semiconductor used systems

x

x

x

ASML Share

57.0%

54.8%

-

53.3%

Non Semiconductor (TFH, MEMS)

-

-

x

-

ASML Share

-

-

57.2%

-

/ Slide 6

 

Accomplishments Q1 2006

Solid execution

Gross margin increased to 40.0% from 37.3% in Q4 ‘05

Operating margin grew to 18.2% from 13.6% in Q4 ‘05

Improved our market position

Gained  7 th customer in Japan – will use ASML immersion tools

Net bookings of 62 systems (47 new) with a value of € 710 million

Immersion

Backlog increased to 18 immersion systems with 5 pending orders for shipment
in 2006

First 1.2NA TWINSCAN XT:1700i shipped early April to Asian customer

42 nm resolution half pitch images produced on the TWINSCAN XT:1700i

Customers demonstrate low defect immersion processes

/ Slide 7

 

Financial accomplishments Q1 2006

Robust financial performance

Revenue of € 629 million, 15% increase over Q4 ‘05

Shipped  51 systems (39  new systems) vs. 47 in Q4 ‘05

ASP new systems is € 13.5 million vs. € 12.5 in Q4 ‘05

Net profit of € 80  million (12.7% of sales) vs. € 52 (9.4%
of sales)

/ Slide 8

 

Financial summary Q1 ‘06

/ Slide 9

 

Total revenues M€

179

609

351

820

526

370

329

318

785

611

616

453

548

533

763

685

629

1959

1543

2465

2529

Peak revenue year 2000 at   € 2.673B

/ Slide 10

 

Revenue breakdown: Q1 2006

Value per type

TWINSCAN

86%

Others
14%

Value per end-use

Foundry

8%

Memory

57%

IDM

35%

Value per technology

KrF

46%

ArF

50%

i-line

4%

Value per region

U.S.

27%

Taiwan

19%

Korea

32%

China

3%

Europe

16%

ROW

3%

Numbers have been rounded for readers’ convenience

units

Units

18

33

Others

TWINSCAN

12

25

14

i-line

KrF

ArF

/ Slide 11

 

Key financial trends 2005 - 2006

/ Slide 12

Numbers have been rounded for readers’ convenience

Profit & Loss Statement

M€

Q1 0

5

Q2 0

5

Q3 0

5

Q4 0

5

Q1

0

6

Units

59

51

39

47

51

Sales

685

763

533

548

62

9

Gross margin

Gross margin %

274

40.0

%

299

39.1

%

197

37.0

%

204

37.3

%

251

40.0

%

R&D

79

82

80

82

87

SG&A

51

55

48

47

50

O

perating income

Operating

income %

144

21.0

%

162

21.2

%

69

12.9

%

75

13.6

%

114

18.2

%

Net income

Net income %

100

14.6

%

112

14.6

%

48

9.0

%

52

9.4

%

80

12.7

%

 

Backlog: litho units and value

/ Slide 13

 

Backlog as of April 2, 2006

85 % of unit backlog carry Q2 + Q3  2006 shipment dates

Q1 net bookings of 62 systems with a value M€ 710 including   
47 new tools with an ASP of M€ 14.3

Note: Due to possible customer changes in delivery schedules and to cancellation of orders, our backlog at any
particular date is not necessarily indicative of actual sales for any succeeding period

Numbers have been rounded for readers’ convenience

New Systems

Used Systems

Total Backlog

M€ 1.560   (1.411)

M€ 36    (23)

M€ 1.596 (1.434)

M€ 16.6      (16.4)

M€ 3.0   (2.6)

M€ 15.1    (15.1)

Backlog

Backlog

94      (86)

12      (9)

106       (95)

Units

Value

ASP

( ) previous quarter data

/ Slide 14

 

Backlog lithography per April 2, 2006

Total value M€ 1,596

Value per type

TWINSCAN

95%

Others

    5%

Value per end-use

Foundry

22%

Memory

49%

IDM

29%

Value per technology

i-line

3%

ArF dry

43 %

KrF

25%

ArF immersion

29 %

Numbers have been rounded for readers’ convenience

Value per region

U.S.

31%

Taiwan

21%

Korea

24%

ROW

2%

Europe

9%

China

8%

Japan

5%

/ Slide 15

 

Q2 outlook

Shipment of 64 systems expected vs. 51 in Q1

ASP for new system shipments expected to be € 14.5 million for
new systems and € 12.3 million for new + refurbished systems

Gross margin expected at 39 – 40%

R&D and SG&A are expected to be € 87 million net of credit and
€ 51 million respectively

ASML expects a sustained level of unit bookings in Q2 similar to
that of Q1, with a Q2 order mix favoring capacity additions in KrF
and i-line systems and shorter order leadtimes

Planning to ship the first EUV Alpha demo tools by mid 2006

Reiterating shipment forecast of 20-25 immersion systems in
2006

/ Slide 16

 

Share Buyback Program

ASML confirms its intention to execute a share buyback
program in 2006

Company will repurchase up to the equivalent of € 400
million of its own shares over the next 12 months

Purpose of the program is to return excess cash to
shareholders through reduction of the number of issued
shares

/ Slide 17

 

Company focus 2006

Continue execution of 2005 focus points

Execute on volume production ramp of the TWINSCAN
XT:1700i, hyper NA tool for 45 nm node

Execute on cost of goods reduction

Execute on lead time reduction

Accelerate the technology leadership gap

Ship 2 EUV Alpha demo tools

Finalize development of the >1.3 NA immersion tool for
shipment in H1 2007

Develop alternative architectures for cost effective
lithography at 32 nm resolution and beyond

/ Slide 18

 

Commitment

JP Morgan 34 th Annual Technology Conference   
San Francisco – May 23, 2006

Eric Meurice, CEO

Exhibit 99.7

 

Safe Harbor

“Safe Harbor” Statement under the U.S. Private Securities
Litigation Reform Act of 1995: the matters discussed in this
presentation may include forward-looking statements that are
subject to risks and uncertainties including, but not limited to:
economic conditions, product demand and semiconductor
equipment industry capacity, worldwide demand and
manufacturing capacity utilization for semiconductors (the
principal product of our customer base), competitive products
and pricing, manufacturing efficiencies, new product
development, ability to enforce patents, the outcome of
intellectual property litigation, availability of raw materials and
critical manufacturing equipment, trade environment, and
other risks indicated in the risk factors included in ASML’s
Annual Report on Form 20-F and other filings with the U.S.
Securities and Exchange Commission.

/ Slide 2

 

                                     Mid-Term Market Update

 

Semiconductor Units history and forecast
2006 Semiconductor consensus growth forecast at +11%

25%        -21%      14%       9%       18%          4%       11%

Source: ASML MCC

/ Slide 4

 

IC unit sales and inventory
Steady demand - inventory under control

Source: WSTS, VLSI Research, ASML

Last data point: March 2006

/ Slide 5

 

Litho Bookings and Billings as % of Semiconductor Revenue
Relative spending on Litho increasing

Source: SEMI, WSTS, ASML

Last data point: March 2006

/ Slide 6

 

Growth from Multiple independent Segments
Each Segment with its own investment cycle

Flash shrink - 12 to 15
month investment cycle

DRAM – closely follows
Flash investment cycle

Foundries represent classic
supply/demand cycle

Moore’s law, 18 to 24
months - invest for new
product development -
volume to Foundry

Shrink for new
functionality and cost per
function - 12 to 24 month
investment cycle

/ Slide 7

 

Market Status Summary

Market players remain cautious:

Inventory/Utilization under evaluation

Industry shows sign of maturing as swings are smaller in
amplitude and length

Wide range of customers are hitting capacity limits

Ordering production capacity tools including used

Utilization rates at approx. 92 %

/ Slide 8

 

Market Status Summary (Cont.)

26 new fab projects under construction:

9 Flash fabs

6 other Memory fabs

11 Foundry or IDM fabs

Immersion enabling 55 nm/45 nm next generation
node for early 2007 production ramp:

Flash next generation

High integration/complexity Logic designs

    LEADING TO A STRONG BOOKINGS OUTLOOK IN Q2 2006

FOR DELIVERIES IN Q3 06, Q4 06, Q1 07

/ Slide 9

 

                                     Long-Term Trajectory

 

Company focus

Execution on Technology – Cost – Leadtime

Execute on Leadership:

Volume production ramp of the TWINSCAN XT:1700i, hyper NA
tool for 45 nm node: 20 - 25 tools to ship in 2006

2 EUV alpha tools mid 2006

R&D investment increased to sustain 1 node/year

Execute on cost of goods reduction:

Internal target of 15% cost of ownership reduction

Redesigns for cost - for performance/availability/throughput

Execute on lead time reduction

Leadtime reduction of 30%

Capacity increase:  50% +

/ Slide 11

 

ASML Secular Growth model

Source: Average of Dataquest, VLSI Research and ASML fab based model

Average WW litho sales

ASML’s potential

Status quo

Natural growth
potential towards
4-5 B € range

ASML’s
opportunity
window

/ Slide 12

 

ASML is well positioned for value generation

Growth

Target of 70% market share

Potential to double top line in 5 years (reference 2005)

Profitability

Track record of last 8 quarters - average 17.1% EBIT
margin

Liquidity

Average M €79 cash generation from operations in last
8 quarters

/ Slide 13

 

Commitment

Merrill Lynch TMT Conference   
London – June 6, 2006

Eric Meurice – CEO

Exhibit 99.8

 

Safe Harbor

“Safe Harbor” Statement under the U.S. Private Securities
Litigation Reform Act of 1995: the matters discussed in this
presentation may include forward-looking statements that are
subject to risks and uncertainties including, but not limited to:
economic conditions, product demand and semiconductor
equipment industry capacity, worldwide demand and
manufacturing capacity utilization for semiconductors (the
principal product of our customer base), competitive products
and pricing, manufacturing efficiencies, new product
development, ability to enforce patents, the outcome of
intellectual property litigation, availability of raw materials and
critical manufacturing equipment, trade environment, and
other risks indicated in the risk factors included in ASML’s
Annual Report on Form 20-F and other filings with the U.S.
Securities and Exchange Commission.

/ Slide 2

 

ASML overview

-7.1%

23396.8

25191.0

Total Market

+2.7%

2786.9

2712.4

  ASML

-6.3%

3480.9

3714.0

  Tokyo Electron Ltd.

-22.9%

4444.7

5768.1

  Applied Materials

2004/

2005

2005

2004

IC Fabrication            
Equipment

Key facts:

Headquarters: Veldhoven,

the Netherlands

Revenue 2005 ~ €2.5 B

Market cap ~ €7.75 B

Employees 5100

Technology Leader/Innovator

ASML TWINSCAN

The world’s leading supplier of Lithography equipment

ASML outperforms in 2005

VLSI Research

Growing market share (revs)

/ Slide 3

 

ASML market share per region in ($)
WW market share 57% in 2005

Europe

Asia
without
Japan

USA

Source: ASML

48%

8%

77%

62%

Japan

/ Slide 4

 

TWINSCAN ™ XT:400 and XT:760 creating value
in non and mid critical applications

XT:400E

Resolution: 350nm

Throughput: 129wph

Lowest CoO in 300mm I-line

XT:760F

Resolution: 130nm

Throughput: 134wph

Superior CoO in 300mm KrF

I-line
29%

KrF
51%

Source: ASML

/ Slide 5

 

TWINSCAN XT:1700i  1.2 NA with 26x33mm 2 field

Imaging

Resolution          45-nm

Overlay

System                        7-nm

Throughput

125 shots               122 wph

            

In-line

Catadioptric

lens design

4 th generation

immersion

technology

High
Efficiency
Polarized

Illuminator

42nm

Market share wet + dry
ArF 68%

Source: ASML

/ Slide 6

 

Key financial trends 2005 - 2006

/ Slide 7

Numbers have been rounded for readers’ convenience

Profit & Loss Statement

M€

Q1 0

5

Q2 0

5

Q3 0

5

Q4 0

5

Q1

0

6

Units

59

51

39

47

51

Sales

685

763

533

548

62

9

Gross margin

Gross margin %

274

40.0

%

299

39.1

%

197

37.0

%

204

37.3

%

251

40.0

%

R&D

79

82

80

82

87

SG&A

51

55

48

47

50

O

perating income

Operating

income %

144

21.0

%

162

21.2

%

69

12.9

%

75

13.6

%

114

18.2

%

Net income

Net income %

100

14.6

%

112

14.6

%

48

9.0

%

52

9.4

%

80

12.7

%

 

                                     Mid-Term Market Update

 

Market Status Summary

2006 IC Unit growth forecast at about 10% / 11%
growth y-o-y

Inventory at appropriate levels for continuous FAB
capacity build up - under scrutiny

Utilization rates at approx. 92 % with wide range of
customers hitting capacity limits

Industry shows sign of maturing as swings are
smaller in amplitude and length

/ Slide 9

 

Source: ASML MCC

25%        -21%      14%       9%       18%          4%       11%

Semiconductor Units history and forecast
2006 Semiconductor consensus growth forecast at +11%

Semiconductor unit Forecast

0

5

10

15

20

25

30

35

40

45

50

Semiconductor Units

Unit Trend

/ Slide 10

 

IC unit sales and inventory
Steady demand - inventory under control

Source: WSTS, VLSI Research, ASML

Last data point: March 2006

IC unit sales and inventory

0

10

20

30

40

50

60

70

80

-

10

20

30

40

50

60

70

80

IC inventory

3mma IC unit Sales

3mma IC unit sales corrected for Inventory

/ Slide 11

 

Source: SEMI, WSTS, ASML

Last data point: March 2006

Litho Bookings and Billings as % of Semiconductor Revenue
Relative Litho spending in range of control

Expose & Write Bookings and Billings as % of Semiconductor

sales

0%

1%

2%

3%

4%

5%

6%

E&W bookings as % of Semi $Sadj 3MMA

E&W billings as % of Semi $ Sadj 3MMA

/ Slide 12

 

Growth from Multiple independent Segments
Each Segment with its own investment cycle

Flash shrink - 12 to 15
month investment cycle

DRAM – closely follows
Flash investment cycle

Foundries represent classic
supply/demand cycle

Moore’s law, 18 to 24
months - invest for new
product development -
volume to Foundry

Shrink for new
functionality and cost per
function - 12 to 24 month
investment cycle

/ Slide 13

 

Further Growth engines:

26 new fab projects under construction:

9 Flash fabs

6 other Memory fabs

11 Foundry or IDM fabs

Immersion enabling 55 nm/45 nm next generation
node for early 2007 production ramp:

Flash next generation

High integration/complexity Logic designs

STRONG BOOKINGS OUTLOOK IN Q2 2006

         FOR DELIVERIES IN Q3 06, Q4 06, Q1 07

NO SHORT TERM OVERHEATING FORESEEN

/ Slide 14

 

                                     Long-Term Trajectory

 

Company focus

Execution on Technology – Cost – Leadtime

Execute on Leadership:

Volume production ramp of the TWINSCAN XT:1700i,
hyper NA tool for 45 nm node: 20 - 25 tools to ship in 2006

2 EUV alpha tools mid 2006

R&D investment increased to sustain an accelerated
roadmap 1 node/year

Execute on cost of goods reduction:

Redesigns for cost - for performance/availability/throughput

Internal target of 15% cost of ownership reduction

Execute on lead time reduction

Leadtime reduction of 30%

Capacity increase:  50% +

/ Slide 16

 

ASML Secular Growth model

Source: Average of Dataquest, VLSI Research and ASML fab based simultion model – NOT A FORECAST

Average WW litho sales

ASML’s potential

Status quo

Natural growth
potential towards
4-5 B € range

ASML’s
opportunity
window

Assumption: 9% IC unit Growth/year

/ Slide 17

 

ASML is well positioned for value generation

Growth

Target of 70% market share

Potential to double top line in 5 years (reference 2005)

Profitability

Track record of last 8 quarters - average 17.1% EBIT
margin

Improvement through scaling

Liquidity

Average M €79 cash generation from operations in last
8 quarters

/ Slide 18

 

/ Slide 19

Bear Stearns 17 th Annual Technology Conference
New York – June 13, 2006

Craig DeYoung – VP Investor Relations

Exhibit 99.9

 

Safe Harbor

“Safe Harbor” Statement under the U.S. Private Securities
Litigation Reform Act of 1995: the matters discussed in this
presentation may include forward-looking statements that are
subject to risks and uncertainties including, but not limited to:
economic conditions, product demand and semiconductor
equipment industry capacity, worldwide demand and
manufacturing capacity utilization for semiconductors (the
principal product of our customer base), competitive products
and pricing, manufacturing efficiencies, new product
development, ability to enforce patents, the outcome of
intellectual property litigation, availability of raw materials and
critical manufacturing equipment, trade environment, and
other risks indicated in the risk factors included in ASML’s
Annual Report on Form 20-F and other filings with the U.S.
Securities and Exchange Commission.

/ Slide 2

 

ASML Investment Thesis

Integrated circuit imaging advancements (shrink) drives
the semiconductor industry (Moore’s law)

ASML is the leading Lithography equipment supplier to
semiconductor industry

There are multiple drivers for ASML’s growth - industry
growth, market share growth and ASP growth

ASML has a sustainable competitive advantage through
technology and scale

ASML will demonstrate strong financial performance in
the years to come

/ Slide 3

 

ASML overview

-7.1%

23396.8

25191.0

Total Market

+2.7%

2786.9

2712.4

  ASML

-6.3%

3480.9

3714.0

  Tokyo Electron Ltd.

-22.9%

4444.7

5768.1

  Applied Materials

2004/

2005

2005

2004

IC Fabrication            
Equipment

Key facts:

Headquarters: Veldhoven,

the Netherlands

Revenue 2005 ~ €2.5 B

Market cap ~ €7.75 B

Employees 5100

Leaders in Innovation

ASML TWINSCAN

The world’s leading supplier of Lithography equipment

ASML outperforms in 2005

VLSI Research

Growing market share (revs)

/ Slide 4

 

ASML market share per region in ($)
WW market share 57% in 2005

Europe

48%

North America

62%

Asia w/o Japan

77%

Japan

  8%

Source: ASML – market shares are
value based in 2005

/ Slide 5

 

Resolution: 130nm

Throughput: 134wph

Superior CoO in 300mm KrF

XT:400

Resolution: 350nm

Throughput: 129wph

Lowest CoO in 300mm i-line

TWINSCAN ™ creating value in non and mid
critical applications

Source: ASML – market shares are
value based in 2005

ASML i-line

market share

29%

ASML KrF

market share

51%

/ Slide 6

 

TWINSCAN XT:1700i  Enabling 45nm production

Imaging

Resolution             45-nm

Overlay

System                          7-nm

Throughput

125 shots                 122 wph

            

In-line

Catadioptric

lens design

4 th generation

immersion

technology

High
Efficiency
Polarized

Illuminator

42nm

1.2 NA with
26x33mm2 field

/ Slide 7

 

TWINSCAN XT:1700i  Enabling 45nm production

ASML wet + dry ArF
market share

68%

Source: ASML – market shares are
value based in 2005

/ Slide 8

 

Key financial trends 2005 - 2006

Numbers have been rounded for readers’ convenience

Profit & Loss Statement

M€

Q1 0

5

Q2 0

5

Q3 0

5

Q4 0

5

Q1

0

6

Units

59

51

39

47

51

Sales

685

763

533

548

62

9

Gross margin

Gross margin %

274

40.0

%

299

39.1

%

197

37.0

%

204

37.3

%

251

40.0

%

R&D

79

82

80

82

87

SG&A

51

55

48

47

50

O

perating income

Operating

income %

144

21.0

%

162

21.2

%

69

12.9

%

75

13.6

%

114

18.2

%

Net income

Net income %

100

14.6

%

112

14.6

%

48

9.0

%

52

9.4

%

80

12.7

%

/ Slide 9

 

                                     Mid-Term Market Update

 

Market Status Summary

2006 IC Unit growth forecast at 10+% growth y-o-y

Inventory at appropriate levels for continuous FAB
capacity build up - under scrutiny

Utilization rates remain high with a wide range of
customers at capacity limits

Industry shows sign of maturing as swings appear
smaller in amplitude and length

/ Slide 11

 

Source: ASML MCC

25%        -21%      14%       9%       18%          4%       14%

Semiconductor Units history and forecast
2006 Semiconductor consensus growth forecast up to 14%

Semiconductor unit Forecast

0

5

10

15

20

25

30

35

40

45

50

Semiconductor Units

Unit Trend

/ Slide 12

 

IC unit sales and inventory
Steady demand -  inventory under scrutiny

Source: WSTS, VLSIResearch, ASML

Last data point: April 2006

IC unit sales and inventory

0

10

20

30

40

50

60

70

80

-

10

20

30

40

50

60

70

80

IC inventory

3mma IC unit Sales

3mma IC unit sales corrected for Inventory

/ Slide 13

 

Source: SEMI, WSTS, ASML

Last data point: April 2006

Litho Bookings and Billings as % of Semiconductor Revenue
Relative Litho spending in range of control

Expose & Write Bookings and Billings as % of Semiconductor

sales

0%

1%

2%

3%

4%

5%

6%

E&W bookings as % of Semi $Sadj 3MMA

E&W billings as % of Semi $ Sadj 3MMA

/ Slide 14

 

Growth from Multiple independent Segments
Each Segment with its own investment cycle

Flash shrink - 12 to 15
month investment cycle

DRAM – closely follows
Flash investment cycle

Foundries represent classic
supply/demand cycle

Moore’s law, 18 to 24
months - invest for new
product development -
volume to Foundry

Shrink for new
functionality and cost per
function - 12 to 24 month
investment cycle

/ Slide 15

 

Further Growth engines:

26 new fab projects under construction:

9 Flash fabs

6 other Memory fabs

11 Foundry or IDM fabs

Immersion enabling 55 nm/45 nm next generation
node for early 2007 production ramp:

Flash next generation

High integration/complexity Logic designs

STRONG BOOKINGS OUTLOOK IN Q2 2006

         FOR DELIVERIES IN Q3 06, Q4 06, Q1 07

NO SHORT TERM OVERHEATING FORESEEN

/ Slide 16

 

                                     Long-Term Trajectory

 

Company focus

Execution on Technology – Cost – Lead time

Execute on Leadership:

Volume production ramp of the TWINSCAN XT:1700i,
hyper NA tool for 45 nm node: 20 - 25 tools to ship in 2006

2 EUV alpha tools mid 2006

R&D investment increased to sustain an accelerated
roadmap of 1 node/year

Execute on cost of goods reduction:

Redesigns for cost - for performance/availability/throughput

Internal target of 15% cost of ownership reduction

Execute on lead time reduction:

Lead time reduction of 30%

Capacity increase:  50% +

/ Slide 18

 

ASML Secular Growth model

Source: Average of Dataquest, VLSI Research and ASML fab based simultion model – NOT A FORECAST

Average WW litho sales

ASML’s potential

Status quo

Natural growth
potential towards
4-5 B € range

ASML’s
opportunity
window

Assumption: 9% IC unit Growth/year

/ Slide 19

 

ASML is well positioned for value generation

Growth

Target of 70% market share

Potential to double top line in 5 years (reference 2005)

Profitability

Track record of last 8 quarters - average 17.1% EBIT
margin

Improvement through scaling

Liquidity

Average M €79 cash generation from operations in last 8
quarters

/ Slide 20

 

/ Slide 21